ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING COMPUTER PROGRAM

PROBLEM TO BE SOLVED: To provide control suitable for an electronic component feeding device having a plurality of lanes corresponding to a component tape holding electronic components.SOLUTION: The electronic component mounting system comprises an electronic component mounting device including a fi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WAKUSHIMA SHUJI, ATSUMI TADASHI, SERIZAWA SEIICHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide control suitable for an electronic component feeding device having a plurality of lanes corresponding to a component tape holding electronic components.SOLUTION: The electronic component mounting system comprises an electronic component mounting device including a first feeding device 30 having a plurality of lanes 31 for feeding an electronic component holding member holding a plurality of electronic components, a second feeding device 32 having a single number of lane 31 and a head 15 for mounting an electronic component on a substrate, and a management device. The management device determines a plurality of production plans for mounting a plurality of types of electronic component 9 on a plurality of types of substrate 8, groups the electronic components 9 used commonly among the plurality of production plans while distinguishing those being taken over among the plurality of production plans from those not being taken over among the plurality of production plans, and assigns the electronic components 9 used commonly among the plurality of production plans preferentially to the lane 31 of the first feeding device 30.