PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN, AND METHOD OF MAKING PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, adhesion, resist shape, tent reliability, scum generation resistance, and chemical resistance, and to provide a photosensitive element, a method of forming a resist pattern and a method of making a printed w...

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Bibliographische Detailangaben
Hauptverfasser:	MURAMATSU YUKIKO, MIYASAKA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, adhesion, resist shape, tent reliability, scum generation resistance, and chemical resistance, and to provide a photosensitive element, a method of forming a resist pattern and a method of making a printed wiring board using the photosensitive resin composition.SOLUTION: The photosensitive resin composition comprises: a binder polymer that has a dispersion degree of 1.6 or less; a photopolymerizable compound including at least one compound selected from the group consisting of a (meth)acrylate compound having a skeleton derived from pentaerythritol and a (meth)acrylate compound having a skeleton derived from dipentaerythritol; and a photopolymerization initiator.