CHUCK DEVICE AND CHUCK METHOD

PROBLEM TO BE SOLVED: To provide a chuck device and a chuck method that can stably chuck a workpiece with flexibility in a non-contact state.SOLUTION: The chuck device for holding the workpiece W with flexibility includes: a bernoulli chuck mechanism 4 which is located on a vertically upper side of...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	MATSUO KENGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a chuck device and a chuck method that can stably chuck a workpiece with flexibility in a non-contact state.SOLUTION: The chuck device for holding the workpiece W with flexibility includes: a bernoulli chuck mechanism 4 which is located on a vertically upper side of the workpiece W to suck the workpiece W in the non-contact state; and a pair of holding means 10 which are oppositely arranged on a horizontal plane across the bernoulli chuck mechanism 4, holds a side edge Wof the workpiece W floated by the suction force by the bernoulli chuck mechanism 4 and bent by self weight and holds the workpiece W at a curved attitude in which a center part Wis located on the vertically upper side of the side edge W.