FILM FORMATION APPARATUS AND FILM FORMATION METHOD

PROBLEM TO BE SOLVED: To reduce the footprint, shorten a length of a process line, and realizes the reduction of apparatus costs and the productivity improvement.SOLUTION: A film formation apparatus includes: coating processing means 6 which transports a processed substrate G in the horizontal direc...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI YOSHIHIRO, SAKAI MITSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce the footprint, shorten a length of a process line, and realizes the reduction of apparatus costs and the productivity improvement.SOLUTION: A film formation apparatus includes: coating processing means 6 which transports a processed substrate G in the horizontal direction, discharges a coating liquid from a nozzle having a discharging port elongated in the width direction of the substrate, and forms a coating film on the substrate; first heating process means 11 heating the substrate where the coating film is formed with a first heating temperature; and second heating process means 12 heating the substrate heated by the first heating process means with a second heating temperature higher than the first heating temperature.