WIRING BODY WITH WIRING SHEET, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

WIRING BODY WITH WIRING SHEET, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a wiring body with a wiring sheet, a semiconductor device, and a method of manufacturing the semiconductor device capable of simplifying a manufacturing process.SOLUTION: A semiconductor device 1 has: a switching element 10 on whose first principal surface 11 a sourc...

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Bibliographische Detailangaben
Hauptverfasser: ARIYOSHI TAKESHI, SAITO HIROHISA, UENISHI NAOTA
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS
BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATION THEREOF
CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring body with a wiring sheet, a semiconductor device, and a method of manufacturing the semiconductor device capable of simplifying a manufacturing process.SOLUTION: A semiconductor device 1 has: a switching element 10 on whose first principal surface 11 a source electrode 14 and a gate electrode 15 are formed and on whose second principal surface 12 a drain electrode 13 is formed; and a conductive layer lamination substrate 80 connected with the drain electrode 13. To the semiconductor device 1, a wiring body 30 with a wiring sheet is applied as an upper side wiring structure. The wiring body 30 with the wiring sheet has a first wiring body 40 connected with the source electrode 14, and a wiring sheet 60 provided with a gate terminal connected with the gate electrode 15. The wiring sheet 60 is attached to a surface to which the source electrode 14 is connected in the first wiring body 40.