LIGHT-EMITTING DEVICE, LIGHT-EMITTING ELEMENT PACKAGE AND WIRING BOARD FOR MOUNTING LIGHT-EMITTING ELEMENT

PROBLEM TO BE SOLVED: To maintain an excellent heat dissipation property while employing a simple single-sided wiring board using an inexpensive circuit board.SOLUTION: A light-emitting device includes: an electrically insulating board 10 having 80% or more of total reflectivity of at least a first...

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Bibliographische Detailangaben
Hauptverfasser: IMAI NOBORU, NAKADA KEITA, ISAKA FUMIYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To maintain an excellent heat dissipation property while employing a simple single-sided wiring board using an inexpensive circuit board.SOLUTION: A light-emitting device includes: an electrically insulating board 10 having 80% or more of total reflectivity of at least a first principal plane 10a to light having a wavelength of 450 nm, and bendable with 50 mm or less of a curvature radius; a metal filling portion 30 composed of a metal material filled in a via hole 13 penetrating through the electrically insulating board 10; a copper wiring pattern 20p provided on the first principal plane 10a side of the electrically insulating board 10, and partially bent to a second principal plane 10b side of the electrically insulating board 10 together with the electrically insulating board 10; and a light-emitting element mounted on the metal filling portion 30 on the first principal plane 10a side, and wire-bonded to the copper wiring pattern 20p on the first principal plane 10a side.