PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition in which a cured film has good resistance to electroless gold plating and occurrence of whitening phenomenon in a solder leveler (a pre-soldering process) and an electroless gold plating process is inhibited, a cured film of the pho...

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Bibliographische Detailangaben
Hauptverfasser:	NORIKOSHI AKIO, ARIMA MASAO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition in which a cured film has good resistance to electroless gold plating and occurrence of whitening phenomenon in a solder leveler (a pre-soldering process) and an electroless gold plating process is inhibited, a cured film of the photosensitive resin composition, and a printed circuit board comprising the cured film.SOLUTION: The photosensitive resin composition is characterized by comprising (A) a non-photosensitive carboxylic acid resin, (B) an aluminum-containing inorganic filler and (C) an epoxy resin. It is suitable that the photosensitive resin composition further comprises a photosensitive monomer.