SUBSTRATE FOR ADHESIVE SKIN PATCH

PROBLEM TO BE SOLVED: To provide a substrate for an adhesive skin patch with both extensibility and heat-generating performance.SOLUTION: A substrate for adhesive skin patch includes a hygroscopic fiber whose moisture percentage is 20% or more and a latent crimp fiber that crimp is actualized, raise...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHOJI YOSHIRO, AIKAWA TOSHIO, MATSUSHITA JUNICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate for an adhesive skin patch with both extensibility and heat-generating performance.SOLUTION: A substrate for adhesive skin patch includes a hygroscopic fiber whose moisture percentage is 20% or more and a latent crimp fiber that crimp is actualized, raises its temperature by 2°C or more at 10 minutes after moisture absorption starts, and has stress at 50% elongation of 5 N/50 mm width or less in at least one direction. In this way, the substrate for adhesive skin patch shows a superior heat-generating performance and extensibility.