HEAT-RESISTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide a heat-resistive adhesive excellent in adhesivity and heat resistance, and having an exact positional selectivity by photocuring.SOLUTION: The heat-resistive adhesive essentially contains (1) an epoxy resin, (2) a radical curing resin, (3) a photoradical initiator, a...

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Bibliographische Detailangaben
Hauptverfasser:	TAMACHI TOMOYA, MATSUDO KAZUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat-resistive adhesive excellent in adhesivity and heat resistance, and having an exact positional selectivity by photocuring.SOLUTION: The heat-resistive adhesive essentially contains (1) an epoxy resin, (2) a radical curing resin, (3) a photoradical initiator, and (4) a latent epoxy curing agent obtained by reacting (a) an amine compound represented by formula (I), (b) a polyamine compound having two or more amino groups in the molecule, (c) an organic polyisocyanate compound and (d) an epoxy compound. In the formula, Rand Rare each independently a 1-8C alkyl group, or mutually bond to form an alkylene group, and the alkylene group may contain an oxygen atom or a nitrogen atom; and n is an integer of 1 to 6.