THERMAL TRANSFER MOLDING DEVICE

PROBLEM TO BE SOLVED: To provide a thermal transfer molding device which can save equipment costs required for a molding device which performs thermal transfer molding under a vacuum (pressure-reduced) condition, and can improve productivity per time by achieving continuous production.SOLUTION: The thermal transfer molding device includes: a conveyance molding unit 10 for depressurizing and conveying a material to be processed; an auxiliary heating part 30 for secondarily heating the material to be processed in the conveyance molding unit; a pressurizing thermal molding part 40 for holding the conveyance molding unit, and heat-molding the material to be processed at higher pressure in comparison with the auxiliary heating part; a pressurizing cooling part 50 for cooling the material to be processed in the conveyance molding unit; an auxiliary cooling part 60 for holding the conveyance molding unit secondarily cooling the material to be processed at lower pressure in comparison with the pressurizing cooling part; a carry-out part 70 for depressurizing the inside of the conveyance molding unit through a deairing part and carrying out the conveyance molding unit toward the auxiliary heating part; a carry-in part 80 for receiving the conveyance molding unit from the auxiliary cooling part and separating the conveyance molding unit; and a conveyance device 100 which includes a connection part 110 and conveys the conveyance molding unit in the order in which each of the parts is arranged, and places the conveyance molding unit in a predetermined position.