BONDED MEMBER MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING BONDED MEMBER

PROBLEM TO BE SOLVED: To prevent relative misalignment between substrates and surface distortion and to keep film thickness uniformity of thin substrate even when one substrate is thin in the case of laminating two substrates to manufacture a bonded member.SOLUTION: An apparatus 10 for manufacturing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAMAGUCHI KOJI, OKAJI HIDEYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!