BONDED MEMBER MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING BONDED MEMBER

PROBLEM TO BE SOLVED: To prevent relative misalignment between substrates and surface distortion and to keep film thickness uniformity of thin substrate even when one substrate is thin in the case of laminating two substrates to manufacture a bonded member.SOLUTION: An apparatus 10 for manufacturing...

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Hauptverfasser:	YAMAGUCHI KOJI, OKAJI HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent relative misalignment between substrates and surface distortion and to keep film thickness uniformity of thin substrate even when one substrate is thin in the case of laminating two substrates to manufacture a bonded member.SOLUTION: An apparatus 10 for manufacturing the bonded member for bonding a first substrate 11 to a second substrate 12 includes: a resin film forming means 20 for forming a resin film 13 in a liquid state on the first substrate 11; a semi-curing means 30 for maintaining the outer peripheral section 14 of the resin film 13 formed by the resin film forming means 20, in an uncured state and curing an inner section 15 surrounded by the outer peripheral section 14, into a semi-cured state; and a substrate laminating means 40 for laminating the first substrate 11 and the second substrate 12 by bringing the second substrate 12 into contact with the resin film 13 with the outer peripheral section 14 in the uncured state and with the inner section 15 in the semi-cured state so that a boundary line between a contact portion and a noncontact portion unidirectionally moves from one end of the outer peripheral section 14 which is set as a starting point 16, to the opposite end while applying pressure to the second substrate 12.