SEMICONDUCTOR INTEGRATED CIRCUIT, ELECTRONIC EQUIPMENT, AND MULTI-CHIP SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit, electronic equipment, and a multi-chip semiconductor package to enable dynamic and high-resolution voltage control despite their relatively simple configuration.SOLUTION: Electronic equipment 100 includes a power supply IC110 and SoC#0 to SoC#2 operating on a power supply voltage Vsrc output from the power supply IC110. The SoC#0 to SoC#2 are installed in a three-dimensionally mounted multi-chip semiconductor package. The SoC#0 to SoC#2 also include a potential control circuit 125 which generates an analog control signal output from a second terminal 122 on the basis of the potential of the analog control signal input from a third terminal 123 and the potential of internal wiring 124, and the second terminal 122 and third terminal 123 which serve as a voltage input terminal for power supply feedback (FB). In addition, the SoC#0 to SoC#2 cascade-connect a FB output terminal FB_out and a FB input terminal FB_in, and connect the FB output of the SoC#0 of the final stage to the power supply IC110.