SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To prevent damages of a substrate due to movement of electric charges during processing by a process liquid, and to prevent adverse influence by mixing of the process liquid and another liquid.SOLUTION: In a substrate processing apparatus 1, an electricity removal liquid whose specific resistance is larger than that of an SPM liquid is supplied onto a substrate 9 by an electricity removal liquid supply part 6, the entire upper surface 91 of the substrate 9 is paddled with the electricity removal liquid, and thus the electricity of the substrate 9 is relatively gently removed. Then, by rotating the substrate 9 by a substrate rotating mechanism 5, the electricity removal liquid is removed from the substrate 9, then the SPM liquid is supplied onto the substrate 9 by a process liquid supply part 3, and SPM processing is performed. Thus, during the SPM processing, rapid movement of a large amount of electric charges from the substrate 9 to the SPM liquid is prevented, and the damages of the substrate 9 are prevented. Also, the adverse influence by mixing of the electricity removal liquid and the SPM liquid (for instance, the damages of the substrate 9 due to reaction heat between water in the electricity removal liquid and sulfuric acid in the SPM liquid) is prevented.