COMPOSITION, COPPER FILM AND METHOD FOR FORMING COPPER FILM

PROBLEM TO BE SOLVED: To provide a composition with which a copper film with a low resistance value can be formed at low cost, to form a copper film using the composition, and to provide a method for forming a copper film.SOLUTION: A composition is prepared so that cuprous oxide, a copper salt and a...

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Hauptverfasser:	ARITOME ISAO, KUWATA HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a composition with which a copper film with a low resistance value can be formed at low cost, to form a copper film using the composition, and to provide a method for forming a copper film.SOLUTION: A composition is prepared so that cuprous oxide, a copper salt and a reductant are contained. At least one selected from the group consisting of copper formate, cuprous acetate, cupric acetate, cupric hydroxide, copper sulfide, cuprous sulfide, cupric sulfide, cuprous chloride, cupric chloride, basic copper carbonate and a hydrate thereof is used as the copper salt, and at least one selected from the group consisting of glycols and aldehydes is used as the reductant. A coating film is formed using the obtained composition, and the coating film is heated under atmosphere to form a copper film.