METHOD FOR PRODUCTION OF RESIN COMPOSITION, RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS
PROBLEM TO BE SOLVED: To provide a method for production of a resin composition excellent in fluidity and curability at a time when sealing a semiconductor device, and to provide the resin composition and a semiconductor apparatus.SOLUTION: There is provided a method for production of a resin compos...
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| creator | SAKUMICHI KEIICHI |
| description | PROBLEM TO BE SOLVED: To provide a method for production of a resin composition excellent in fluidity and curability at a time when sealing a semiconductor device, and to provide the resin composition and a semiconductor apparatus.SOLUTION: There is provided a method for production of a resin composition which is used for sealing a semiconductor chip 120 installed on a circuit board 110 and is also filled in an interspace between the circuit board 110 and the chip 120 when sealing. The method includes a pulverizing step of pulverizing a raw material including the powdery material of a curable resin and that of an inorganic filler in which the content of particles having the size exceeding 24 μm is 1 mass% or less, and a kneading step of kneading the raw material after pulverizing. In the kneading step, a kneading energy applied to 1 kg of the raw material after pulverizing is made to be 0.01-0.5 kWh/kg. |
| format | Patent |
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The method includes a pulverizing step of pulverizing a raw material including the powdery material of a curable resin and that of an inorganic filler in which the content of particles having the size exceeding 24 μm is 1 mass% or less, and a kneading step of kneading the raw material after pulverizing. 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The method includes a pulverizing step of pulverizing a raw material including the powdery material of a curable resin and that of an inorganic filler in which the content of particles having the size exceeding 24 μm is 1 mass% or less, and a kneading step of kneading the raw material after pulverizing. In the kneading step, a kneading energy applied to 1 kg of the raw material after pulverizing is made to be 0.01-0.5 kWh/kg.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | METHOD FOR PRODUCTION OF RESIN COMPOSITION, RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS |
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