METHOD FOR PRODUCTION OF RESIN COMPOSITION, RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS

METHOD FOR PRODUCTION OF RESIN COMPOSITION, RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To provide a method for production of a resin composition excellent in fluidity and curability at a time when sealing a semiconductor device, and to provide the resin composition and a semiconductor apparatus.SOLUTION: There is provided a method for production of a resin compos...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SAKUMICHI KEIICHI
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for production of a resin composition excellent in fluidity and curability at a time when sealing a semiconductor device, and to provide the resin composition and a semiconductor apparatus.SOLUTION: There is provided a method for production of a resin composition which is used for sealing a semiconductor chip 120 installed on a circuit board 110 and is also filled in an interspace between the circuit board 110 and the chip 120 when sealing. The method includes a pulverizing step of pulverizing a raw material including the powdery material of a curable resin and that of an inorganic filler in which the content of particles having the size exceeding 24 μm is 1 mass% or less, and a kneading step of kneading the raw material after pulverizing. In the kneading step, a kneading energy applied to 1 kg of the raw material after pulverizing is made to be 0.01-0.5 kWh/kg.