MULTILAYER CIRCUIT BOARD WITH BUILT-IN THROUGH CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CIRCUIT BOARD WITH BUILT-IN THROUGH CAPACITOR

PROBLEM TO BE SOLVED: To provide a multilayer circuit board with a built-in through capacitor in which occurrence of poor connection of the through capacitor can be reduced, and to provide a mounting structure of the multilayer circuit board with a built-in through capacitor.SOLUTION: In a multilaye...

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Bibliographische Detailangaben
1. Verfasser: TOGASHI MASAAKI
Format: Patent
Sprache:eng
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