MULTILAYER CIRCUIT BOARD WITH BUILT-IN THROUGH CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CIRCUIT BOARD WITH BUILT-IN THROUGH CAPACITOR
PROBLEM TO BE SOLVED: To provide a multilayer circuit board with a built-in through capacitor in which occurrence of poor connection of the through capacitor can be reduced, and to provide a mounting structure of the multilayer circuit board with a built-in through capacitor.SOLUTION: In a multilaye...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a multilayer circuit board with a built-in through capacitor in which occurrence of poor connection of the through capacitor can be reduced, and to provide a mounting structure of the multilayer circuit board with a built-in through capacitor.SOLUTION: In a multilayer circuit board 1 with a built-in through capacitor, the through capacitor 21 is disposed in the circuit board 11, and the noise component can be fed from the grounding terminal electrode 24 of the through capacitor 21 to a ground conductor layer 13 and removed. In the multilayer circuit board 1 with a built-in through capacitor, a ground plane 14c for connection with the grounding terminal electrode 24 of the through capacitor 21 is arranged as a conductor layer on the same stage as a power supply plane 14a and the power supply wiring 14b being connected with the terminal electrode 23 for signal of the through capacitor 21. Since the connection of the through capacitor 21 and a power supply conductor layer 14 and the ground conductor layer 13 are achieved on the same stage, occurrence of poor connection can be reduced even if some variations occur in the dimensions of the through capacitor 21. |
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