PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a printed circuit board which can improve the consistency according the position of a wiring substrate in the exposure step, and the method for manufacturing the same.SOLUTION: The method for manufacturing a printed circuit board concerned includes a step of forming...
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| creator | MOK JEE-SOO |
| description | PROBLEM TO BE SOLVED: To provide a printed circuit board which can improve the consistency according the position of a wiring substrate in the exposure step, and the method for manufacturing the same.SOLUTION: The method for manufacturing a printed circuit board concerned includes a step of forming two or more of printing areas 2 to 5 and forming two or more positioning marks 11 to 16 for each of the printing areas 2 to 5, a step of forming a solder resist layer on the wiring substrate 1, a step of forming measurement data by reading the wiring pattern, a step of calculating the error by comparing the coordinate value of the measurement data with the coordinate value of reference data, a step of forming corrected data by correcting the reference data to cope with the error, and a step of forming a solder resist pattern by exposing the wiring substrate 1 to match with the corrected data. |
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the same.SOLUTION: The method for manufacturing a printed circuit board concerned includes a step of forming two or more of printing areas 2 to 5 and forming two or more positioning marks 11 to 16 for each of the printing areas 2 to 5, a step of forming a solder resist layer on the wiring substrate 1, a step of forming measurement data by reading the wiring pattern, a step of calculating the error by comparing the coordinate value of the measurement data with the coordinate value of reference data, a step of forming corrected data by correcting the reference data to cope with the error, and a step of forming a solder resist pattern by exposing the wiring substrate 1 to match with the corrected data.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINING MACHINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PRINTING 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JEE-SOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME</title><date>2013-04-22</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide a printed circuit board which can improve the consistency according the position of a wiring substrate in the exposure step, and the method for manufacturing the same.SOLUTION: The method for manufacturing a printed circuit board concerned includes a step of forming two or more of printing areas 2 to 5 and forming two or more positioning marks 11 to 16 for each of the printing areas 2 to 5, a step of forming a solder resist layer on the wiring substrate 1, a step of forming measurement data by reading the wiring pattern, a step of calculating the error by comparing the coordinate value of the measurement data with the coordinate value of reference data, a step of forming corrected data by correcting the reference data to cope with the error, and a 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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES STAMPS TRANSPORTING TYPEWRITERS |
| title | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T04%3A26%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MOK%20JEE-SOO&rft.date=2013-04-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013071455A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |