PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a printed circuit board which can improve the consistency according the position of a wiring substrate in the exposure step, and the method for manufacturing the same.SOLUTION: The method for manufacturing a printed circuit board concerned includes a step of forming two or more of printing areas 2 to 5 and forming two or more positioning marks 11 to 16 for each of the printing areas 2 to 5, a step of forming a solder resist layer on the wiring substrate 1, a step of forming measurement data by reading the wiring pattern, a step of calculating the error by comparing the coordinate value of the measurement data with the coordinate value of reference data, a step of forming corrected data by correcting the reference data to cope with the error, and a step of forming a solder resist pattern by exposing the wiring substrate 1 to match with the corrected data.