GRINDING WHEEL FORMING METHOD, AND GRINDING MACHINE

PROBLEM TO BE SOLVED: To provide a grinding wheel forming method including abrasive grain protrusion amount measuring method usable even during a grinding wheel forming process, and to provide a grinding machine.SOLUTION: After truing of a metal bond grinding wheel, a first capacitance Ct, which is...

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Bibliographische Detailangaben
Hauptverfasser: ITO AKIRA, SHINNO YASUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a grinding wheel forming method including abrasive grain protrusion amount measuring method usable even during a grinding wheel forming process, and to provide a grinding machine.SOLUTION: After truing of a metal bond grinding wheel, a first capacitance Ct, which is the capacitance between a capacitance sensor separated from a formed face f by din the vertical direction and a predetermined formed face, and a second capacitance Ct, which is the capacitance between a capacitance measuring device separated from the formed face f by din the vertical direction and the predetermined formed face f, are measured. After dressing, a third capacitance Cd, which is the capacitance between the capacitance measuring device separated from the position of the predetermined formed face f by din the vertical direction and the predetermined formed face f, and a fourth capacitance Cd, which is the capacitance between the capacitance measuring device separated from the predetermined formed face f by din the vertical direction and the predetermined formed face f, are measured. The abrasive grain protrusion amount h after dressing is calculated by formula: h=((Ct-Cd)×d-(Ct-Cd)×d)/((Ct-Cd)×d-(Ct-Cd)×d).