MANUFACTURING METHOD OF DOUBLE-SIDED PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method of double-sided printed wiring board capable of achieving both enhancement in reliability of interlayer conduction and enhancement in degree-of-freedom in design of wiring pattern.SOLUTION: The manufacturing method of a double-sided printed wiring board 1 having an interlayer conduction part 5 includes a preparation step S11 for preparing a double-sided conductive layer multilayer substrate 1a having a base film 2, conductive layers 3a, 4a and the interlayer conduction part 5, a first resist layer formation step S20 for forming a first resist layer 82 on the conductive layers 3a, 4a, a second resist layer formation step S30 for forming a second resist layer 83 on the lands 51, 52 of the interlayer conduction part 5, a resist pattern formation step S40 for forming a resist pattern on the first resist layer 82, a wiring pattern formation step S50 for forming wiring patterns 3, 4, and a resist layer removal step S60 for removing the first and second resist layers 82, 83.