PHOTOSENSITIVE RESIN COMPOSITION, AND PRINTED WIRING BOARD AND REFLECTION SHEET HAVING CURED COATING OF PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, in which a margin for a preliminary drying time and a shelf time after preliminary drying can be ensured for a long period of time without impairing hardness of a coating film and solder heat resistance, and sticking to a negative...

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Bibliographische Detailangaben
1. Verfasser:	TANIGUCHI YASUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, in which a margin for a preliminary drying time and a shelf time after preliminary drying can be ensured for a long period of time without impairing hardness of a coating film and solder heat resistance, and sticking to a negative film after exposure can be prevented.SOLUTION: The photosensitive resin composition comprises (A) a carboxyl group-containing photosensitive resin, (B) a crystalline epoxy compound having a melting point of 130°C or higher and 150°C or lower, (C) a solvent, (D) a photopolymerization initiator and (E) a reactive diluent.