PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE USING THE SAME

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive that has adhesion at normal temperature, can be adhered to an adherend with a light pressure, and has high heat resistance.SOLUTION: A pressure-sensitive adhesive composition includes: a polyimidesiloxane that consists of an aromatic tet...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIGUCHI SHUICHI, WATAKABE HIDEJI, OZAWA HIDEO, AOKI FUMIO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive that has adhesion at normal temperature, can be adhered to an adherend with a light pressure, and has high heat resistance.SOLUTION: A pressure-sensitive adhesive composition includes: a polyimidesiloxane that consists of an aromatic tetracarboxylic acid component and a diaminopolysiloxane component; and an organic peroxide. A pressure-sensitive adhesive tape has an adhesive layer that uses the pressure-sensitive adhesive composition.