DIE BONDER AND DIE PICKUP DEVICE AND DIE PICKUP METHOD

PROBLEM TO BE SOLVED: To provide a pickup device capable of peeling off a die reliably, and to provide a highly reliable die bonder or pickup method by using the pickup device.SOLUTION: When peeling off a die to be peeled off, out of a plurality of dies stuck to a dicing film, from the dicing film by pushing up the die, a start-of-peeling point is formed by pushing up the dicing film in a prescribed part out of the peripheral part of the die. Subsequently, the die is peeled off from the dicing film by pushing up the dicing film at a part other than the prescribed part.