LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD

PROBLEM TO BE SOLVED: To provide a copper electroplating method which alleviates internal stress in copper deposits.SOLUTION: The method includes contacting a substrate with a composition containing one or more sources of copper ions, one or more suppressors and one or more accelerators in sufficien...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KARAYA NARSMOUL, ALLARDYCE GEORGE R, GARY HAM
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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