LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD

LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD

PROBLEM TO BE SOLVED: To provide a copper electroplating method which alleviates internal stress in copper deposits.SOLUTION: The method includes contacting a substrate with a composition containing one or more sources of copper ions, one or more suppressors and one or more accelerators in sufficien...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KARAYA NARSMOUL, ALLARDYCE GEORGE R, GARY HAM
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a copper electroplating method which alleviates internal stress in copper deposits.SOLUTION: The method includes contacting a substrate with a composition containing one or more sources of copper ions, one or more suppressors and one or more accelerators in sufficient amounts to provide a copper deposit of matt appearance. The accelerators include 3-mercaptopropane-1-sulfonic acid, ethylenedithiodipropyl sulfonic acid, bis-(ω-sulfobutyl)-disulfide, methyl-(ω-sulfopropyl)-disulfide, N,N-dimethyldithiocarbamic acid(3-sulfopropyl)ester, (O-ethyldithiocarbonato)-S-(3-sulfopropyl)-ester, 3-[(amino-iminomethyl)-thiol]-1-propanesulfonic acid, 3-(2-benzylthiazolylthio)-1-propanesulfonic acid, bis-(sulfopropyl)-disulfide and alkali metal salts thereof.