GLASS PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, ATOMIC CLOCK, AND METHOD FOR MANUFACTURING GLASS PACKAGE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass package that can secure continuity between the inside and outside of a cavity, by flattening its level difference with a base substrate that arises after baking a glass composition, and to provide a glass package, piezoelectric vibr...

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Bibliographische Detailangaben
Hauptverfasser:	KUTANI HITOMI, FUNABIKI YOICHI, NUMATA SATOSHI, TAKAYAMA TAKUYA, KURITA SUMIHIKO, YANO NOBORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass package that can secure continuity between the inside and outside of a cavity, by flattening its level difference with a base substrate that arises after baking a glass composition, and to provide a glass package, piezoelectric vibrator, oscillator, electronic device and atomic clock.SOLUTION: A crystalline glass body 32 packed between throughholes 21, 22 and a metal core material 31 is a sintered product obtained by baking a bismuth-based glass composition having 60-80 mass% of BiO, 5-20 mass% of SiO, 0.5-8 mass% of AlO, 0.5-13 mass% of BO, and 0-12 mass% of ZnO in terms of oxides.