LIQUID PROCESSING APPARATUS AND CONTROL METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a single wafer processing type substrate processing apparatus and a substrate processing method which prevent a liquid from adhering to a surface opposite to a cleaning surface of a substrate.SOLUTION: A liquid processing apparatus includes: a rotation plate which is...

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Bibliographische Detailangaben
Hauptverfasser:	MORI NOBUHIKO, HIDAKA SHOICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a single wafer processing type substrate processing apparatus and a substrate processing method which prevent a liquid from adhering to a surface opposite to a cleaning surface of a substrate.SOLUTION: A liquid processing apparatus includes: a rotation plate which is rotatable; a substrate support part provided along a periphery of the rotation plate and supporting the substrate; guide parts, each of which is provided at an upper end of the substrate support part and supports the periphery of the substrate thereby guiding the substrate; and a supply part supplying a liquid from above to the substrate having the periphery supported by the substrate support part. Three or more guide parts are provided along the circumferential direction of the rotation plate and have heights higher than a surface of the substrate having the periphery supported by the substrate support part. The above problem is solved by the liquid processing apparatus.