COOLING STRUCTURE OF POWER SUPPLY DEVICE AND GUIDE UNIT

PROBLEM TO BE SOLVED: To minimize variation in cooling performance of each cell stack in a power supply device including a plurality of cell stacks.SOLUTION: The cooling structure of a power supply device comprises a plurality of cell stacks consisting of a plurality of laminated power storage bodie...

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1. Verfasser: YODA TAKEHITO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To minimize variation in cooling performance of each cell stack in a power supply device including a plurality of cell stacks.SOLUTION: The cooling structure of a power supply device comprises a plurality of cell stacks consisting of a plurality of laminated power storage bodies, and guide units forming a flow passage contiguous to respective cell stack in the lamination direction of the cell stack distributing a temperature adjustment medium for adjusting the temperature of the cell stack. The guide unit is provided in the space between the cell stacks disposed side by side, and has an inter-stack guide member including a flow passage formation section for forming each flow passage corresponding to each cell stack by sectioning the space in the arrangement direction of the cell stack, and a movement allowing section which allows movement of the flow passage formation section in the arrangement direction of the cell stack.