MAGNETRON SPUTTER CATHODE

PROBLEM TO BE SOLVED: To provide a magnetron sputter cathode that can prevent a target from causing local erosion therein and improve utilization efficiency of the target.SOLUTION: The magnetron sputter cathode includes: the target 1a having a three-dimensional shaped outline; and a magnet unit 2a f...

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Bibliographische Detailangaben
Hauptverfasser:	USAMI TATSUMI, ISHIBASHI AKIRA, TAKAHASHI AKIHISA, KUBO MASASHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a magnetron sputter cathode that can prevent a target from causing local erosion therein and improve utilization efficiency of the target.SOLUTION: The magnetron sputter cathode includes: the target 1a having a three-dimensional shaped outline; and a magnet unit 2a for exciting a tunnel-like magnetic field. The magnet unit is configured so that the surface of the target is used as sputter surfaces 12a, 12c that are partially eroded by sputtering; and a line passing through a position where a vertical component of the magnetic field becomes zero, and circles around the target while striding over the sputter surfaces.