SOLID-STATE IMAGING ELEMENT AND MOUNTING STRUCTURE FOR THE SAME

PROBLEM TO BE SOLVED: To provide a solid-state imaging element and a mounting structure for the same capable of reducing a cost and a preparation time period of an external circuit, a mounting member and the like with ease.SOLUTION: A solid-state imaging element IS1 has: a semiconductor substrate 1 having a light sensitive region 3; a plurality of first electrode pads 10 arranged on a principal surface 1a of the semiconductor substrate 1; a plurality of second electrode pads 12 arranged on the principal surface 1a of the semiconductor substrate 1 in a direction along the direction where the plurality of first electrode pads 10 are arranged; and a plurality of wires 14 connecting between the plurality of first electrode pads 10 and the plurality of second electrode pads 12 one by one. The plurality of wires 14 connect between the first electrode pads 10 and the second electrode pads 12 that have a position relation symmetry to a center line l orthogonal to the arrangement direction of the plurality of first and second electrode pads 10 and 12.