PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To enhance connection reliability while suppressing variation in the amount of solder coating on a land, in a printed circuit board having a land of normal resist structure.SOLUTION: In the printed circuit board having a land of normal resist structure, a solid filling member h...

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Bibliographische Detailangaben
1. Verfasser:	SHIOMI TAKUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To enhance connection reliability while suppressing variation in the amount of solder coating on a land, in a printed circuit board having a land of normal resist structure.SOLUTION: In the printed circuit board having a land of normal resist structure, a solid filling member having a predetermined height from one surface of an insulating base material is provided in a region where the side surface of the land formed on one surface of the insulating base material faces the aperture side wall surface of a solder resist formed on one surface of the insulating base material while having an aperture for exposing the land to the outside, in contact with the side surface of the land and the sidewall surface of the aperture. The filling member is fused by reflow at the time of soldering, and is formed using a resin material exhibiting wettability to the surface of the land lower than that of a molten solder placed on the upper surface of the land at the time of soldering.