FORMATION METHOD OF CONDUCTIVE METAL FILM

PROBLEM TO BE SOLVED: To provide a method of forming a circuit pattern consisting of a conductive metal film exhibiting excellent adhesion to a substrate, by utilizing metal nanoparticles of dry powder.SOLUTION: Primer is printed on a substrate in a coating pattern corresponding to the shape of a pr...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HATA NORIAKI, HOSOYA KAZUO, MATSUBA YORISHIGE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of forming a circuit pattern consisting of a conductive metal film exhibiting excellent adhesion to a substrate, by utilizing metal nanoparticles of dry powder.SOLUTION: Primer is printed on a substrate in a coating pattern corresponding to the shape of a predetermined circuit pattern, metal nanoparticles of dry powder are sprayed on the substrate, and fixed selectively through the primer coating film in the coating pattern. After removing the not fixed metal nanoparticles of dry powder, heating treatment is performed and the metal nanoparticles thus fixed are calcined through the primer coating film, thus forming a circuit pattern consisting of a conductive metal film exhibiting excellent adhesion due to an adhesion imparting component contained in the primer.