POLYAMIDE RESIN COMPOSITION, AND MOLDING THEREOF

PROBLEM TO BE SOLVED: To provide a polyamide resin composition having good heat resistance, heat conductivity and besides good appearance.SOLUTION: The polyamide resin composition contains a polyamide (A) comprising a terephthalic acid component and a 8-12C straight-chain aliphatic diamine component...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ITO AKIRA, FURUKAWA MIKIO, KAIHARA OSAMU, MASAI YUYA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!