POLYAMIDE RESIN COMPOSITION, AND MOLDING THEREOF

POLYAMIDE RESIN COMPOSITION, AND MOLDING THEREOF

PROBLEM TO BE SOLVED: To provide a polyamide resin composition having good heat resistance, heat conductivity and besides good appearance.SOLUTION: The polyamide resin composition contains a polyamide (A) comprising a terephthalic acid component and a 8-12C straight-chain aliphatic diamine component...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ITO AKIRA, FURUKAWA MIKIO, KAIHARA OSAMU, MASAI YUYA
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polyamide resin composition having good heat resistance, heat conductivity and besides good appearance.SOLUTION: The polyamide resin composition contains a polyamide (A) comprising a terephthalic acid component and a 8-12C straight-chain aliphatic diamine component, and a heat-conductive filler (B), wherein the volume ratio (A/B) of (A) and (B) is 30/70 to 90/10; a triamine unit to a diamine unit in the polyamide (A) is ≤0.3 mol%; and the straight-chain aliphatic diamine is 1,10-decanediamine.