POLYAMIDE RESIN COMPOSITION, AND MOLDING THEREOF

PROBLEM TO BE SOLVED: To provide a polyamide resin composition having good heat resistance, heat conductivity and besides good appearance.SOLUTION: The polyamide resin composition contains a polyamide (A) comprising a terephthalic acid component and a 8-12C straight-chain aliphatic diamine component...

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Hauptverfasser:	ITO AKIRA, FURUKAWA MIKIO, KAIHARA OSAMU, MASAI YUYA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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creator	ITO AKIRA FURUKAWA MIKIO KAIHARA OSAMU MASAI YUYA
description	PROBLEM TO BE SOLVED: To provide a polyamide resin composition having good heat resistance, heat conductivity and besides good appearance.SOLUTION: The polyamide resin composition contains a polyamide (A) comprising a terephthalic acid component and a 8-12C straight-chain aliphatic diamine component, and a heat-conductive filler (B), wherein the volume ratio (A/B) of (A) and (B) is 30/70 to 90/10; a triamine unit to a diamine unit in the polyamide (A) is ≤0.3 mol%; and the straight-chain aliphatic diamine is 1,10-decanediamine.
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subjects	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title	POLYAMIDE RESIN COMPOSITION, AND MOLDING THEREOF
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