CAMERA MODULE AND METHOD OF MANUFACTURING ELEMENT MOUNT SUBSTRATE

PROBLEM TO BE SOLVED: To provide a technique for further reducing a thickness of a camera module.SOLUTION: On a first element mount substrate 110, on which a semiconductor element 120 is mounted, a second element mount substrate 210, on which a lens 290 and a chip component 220 are mounted via a sol...

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Bibliographische Detailangaben
Hauptverfasser:	USUI RYOSUKE, NAKAZATO MAYUMI, TABATA OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technique for further reducing a thickness of a camera module.SOLUTION: On a first element mount substrate 110, on which a semiconductor element 120 is mounted, a second element mount substrate 210, on which a lens 290 and a chip component 220 are mounted via a solder ball 270, is stacked. An opening 300 is provided on the second element mount substrate 210, so as to correspond to a region in which the semiconductor element 120 is installed. A transparent member 310 is embedded in the opening 300. An outer periphery of the transparent member 310 is adhered to an inner wall of the second element mount substrate 210 exposed to the opening 300 via an adhesive agent 320.