ELEMENT MOUNT SUBSTRATE AND SEMICONDUCTOR MODULE

ELEMENT MOUNT SUBSTRATE AND SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a technique for increasing stiffness of an element mount substrate comprising an opening for letting electromagnetic waves pass through.SOLUTION: An element mount substrate 210, on which a chip component 220 is mounted, comprises an opening 300 so as to correspond to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: USUI RYOSUKE, NAKAZATO MAYUMI, TABATA OSAMU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a technique for increasing stiffness of an element mount substrate comprising an opening for letting electromagnetic waves pass through.SOLUTION: An element mount substrate 210, on which a chip component 220 is mounted, comprises an opening 300 so as to correspond to a region in which a semiconductor element 120 is to be installed. A transparent member 310 is embedded in the opening 300. A side surface of an outer periphery of the transparent member 310 is adhered to an inner wall of the element mount substrate 210 exposed to the opening 300 via an adhesive agent 320.