ORGANIC SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide an organic semiconductor device which exhibits excellent connection accuracy of a connection land and an electrode by limiting slip between a sealing material and a laminate when sealing the laminate under reduced pressure by using a film as the sealing material, and also exhibits excellent sealing performance.SOLUTION: Between a laminate 12 and a first film substrate 14, an anti-slip material 48 for preventing slip from occurring therebetween when the laminate 12 is sealed is provided. Since slip is prevented therebetween, positions of a through hole 38 and electrodes 30, 32 of the laminate 12 are matched, and the electrodes 30, 32 of the laminate 12 are led out by a conductive material 40 through the through hole 38.