PHOTOSENSITIVE RESIN COMPOSITION, RELIEF PATTERN FORMING MATERIAL, PHOTOSENSITIVE FILM, POLYIMIDE FILM, CURED RELIEF PATTERN, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a cured relief pattern which has a lithography performance excellent in resolution and sensitivity and prevents the warpage of a wafer through low-temperature curing, and to provide a relief pattern forming materi...

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Hauptverfasser: WADA KENJI, ARAYAMA KYOHEI, AMAMIYA TAKUMA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a cured relief pattern which has a lithography performance excellent in resolution and sensitivity and prevents the warpage of a wafer through low-temperature curing, and to provide a relief pattern forming material using the photosensitive resin composition, a photosensitive film, a polyimide film, a cured relief pattern, a method for manufacturing the cured relief pattern, and a semiconductor device including the cured relief pattern.SOLUTION: A photosensitive resin composition contains (a) a resin having a repeating unit represented by formula (1), and (b) a compound for generating an acid by irradiation of active rays or radiation. In the formula (1), Rrepresents a bivalent organic group. A plurality of Rmay be the same or different from one another. At least one Rout of the plurality of Ris a bivalent organic group having an alicyclic group. Reach independently represents a hydrogen atom or an organic group. At least one -CORout of the plurality of -CORis a group which is decomposed by the action of an acid to generate an alkaline soluble group.