POSITIONING METHOD OF SUBSTRATE

PROBLEM TO BE SOLVED: To provide a positioning method of a substrate capable of recognizing first and second alignment marks accurately.SOLUTION: The positioning method of a substrate includes a first alignment mark position information acquisition step (S13) for acquiring the position information o...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SHIMIZU TORU, YONETANI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FREQUENCY-CHANGING HOLOGRAPHY MATERIALS THEREFOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a positioning method of a substrate capable of recognizing first and second alignment marks accurately.SOLUTION: The positioning method of a substrate includes a first alignment mark position information acquisition step (S13) for acquiring the position information of a first alignment mark by performing differentiation and projection addition in the X direction and Y direction and detecting the first alignment mark, a second alignment mark position information acquisition step (S16) for acquiring the position information of a second alignment mark by performing differentiation and projection addition in the X direction and Y direction for a region excepting the region occupied by the first alignment mark and detecting the second alignment mark, and a positioning step (S17) for moving the substrate and a mask relatively on the basis of the position information of the first alignment mark and the position information of the second alignment mark.