SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a circuit board of an LED device having a structure comparable to a single-sided FPC (Flexible Printed Circuit) board and including electrodes on both surfaces because a double-sided FPC is required when achieving thinning of the LED device by thinning of the circuit board.SOLUTION: A circuit board 12 comprises: a film base material 14 having through holes 26; a metal pattern 23 arranged on a top face of the film base material 14 to block the through holes 26; a plating layer 22 formed above the metal pattern 23; a plating layer 24 formed under the metal pattern 23 so as to fill the through holes 26. The plating layer 22 functions as a mounting electrode for an LED element 21. The plating layer 24 functions as a connection electrode for an external circuit.