WIRE SAW

PROBLEM TO BE SOLVED: To provide a wire saw achieving higher machining efficiency and lower manufacturing cost without requiring work to adhere/separate a workpiece before/after cutting work.SOLUTION: A wire 12 is circled several times between a plurality of machining rollers 11. Above a region wher...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIMADA HITOSHI, TANIZAKI HIROSHI, YABU YOSUKE, KAWAZU TOMOYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BROACHING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PLANING POLISHING SAWING SCRAPING SEMICONDUCTOR DEVICES SHEARING SLOTTING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wire saw achieving higher machining efficiency and lower manufacturing cost without requiring work to adhere/separate a workpiece before/after cutting work.SOLUTION: A wire 12 is circled several times between a plurality of machining rollers 11. Above a region where the wire 12 is circled, there are provided a clamping mechanism 13 for elastically clamping the workpiece W in its horizontal direction, and a depressing mechanism 25 for depressing the workpiece W clamped by the clamping mechanism 13 toward the wire 12.