SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To make a reflection member arranged on a circuit board 12 thinner with expanding a range of material choices for the circuit board 12 when improving reflection coefficient of the circuit board 12, and make it easy to manufacture an entire LED device.SOLUTION: A reflection member is arranged on a circuit board 12 and composed of a reflection sheet 15 including a metal layer. The reflection sheet 15 has an opening conductive connection part for an LED die 16 and packaging electrodes 13a, 14a of the circuit board 12, and adhered to a top face of the circuit board 12. Since an upper part of the circuit board 12 is covered with the reflection sheet 15, it becomes unnecessary to consider reflection characteristics of a base material 12a, and a range of material choices is expanded. At the same time, since the metal layer can be extremely thin, the reflection sheet 15 can be thinner.