THIN FILM MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME AND SEMICONDUCTOR THIN FILM COMPONENT USED THEREFOR

PROBLEM TO BE SOLVED: To provide a thin film manufacturing method of manufacturing a high quality semiconductor thin film.SOLUTION: A thin film manufacturing method comprises: a process S1 of depositing a semiconductor thin film such as an a-Si film on a first substrate; a process S2 of etching the...

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Hauptverfasser: AZUMA SEIICHIRO, SAKAIKE KOHEI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thin film manufacturing method of manufacturing a high quality semiconductor thin film.SOLUTION: A thin film manufacturing method comprises: a process S1 of depositing a semiconductor thin film such as an a-Si film on a first substrate; a process S2 of etching the first substrate to form hollow parts between the first substrate and the semiconductor thin film; a process S3 of contacting a second substrate with the semiconductor thin film; a process S4 of pressing the second substrate to the semiconductor thin film, or irradiating laser beams having an intensity at which the semiconductor thin film melts on the semiconductor thin film; and a process S5 of detaching the first substrate from the semiconductor thin film.