VERIFICATION DEVICE AND VERIFICATION METHOD FOR INFRARED THERMAL IMAGE ARRAY MODULE

PROBLEM TO BE SOLVED: To provide a verification device and a verification method for infrared thermal image array module.SOLUTION: The verification device and verification method for infrared thermal image array module include thermal image module standard design, and epitaxial and optical property verification 10, and calibrate an epitaxial parameter. A single quick-close type sensing component manufacturing process and temperature-changing photoelectric quantity measurement verification 20 are performed, and hereby the epitaxial completes low-temperature temperature change and transformation measurement calibration of a sensing component. A focal plane array manufacturing process and verification 30 of its photoelectric uniformity are carried out, and a dark current uniformity test is conducted. Adhesion between a focal plane array and a signal readout integrated circuit, and verification 40 of a polishing manufacturing process are carried out. Indium adhesion is performed between a sensing module and the signal readout integrated circuit, and thereby a photoelectric signal is converted. Thermal image quality integration test verification 50 is performed, and optimum driving, control output parameter analysis and measurement are adjusted. A thermal image array module model is performed, and bonding with the focal plane sensing array is performed to achieve completion 60 of an image sensing array module model.