MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR MANUFACTURING THE SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a multilayer resin sheet that can form a cured multilayer resin sheet having excellent heat conductivity, adhesion strength, and insulation properties.SOLUTION: The multilayer resin sheet includes: a resin composition layer containing a thermosetting resin and a fill...

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Bibliographische Detailangaben
Hauptverfasser:	KUWANO ATSUSHI, SHIRASAKA TOSHIAKI, NISHIYAMA TOMOO, AWANO YASUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multilayer resin sheet that can form a cured multilayer resin sheet having excellent heat conductivity, adhesion strength, and insulation properties.SOLUTION: The multilayer resin sheet includes: a resin composition layer containing a thermosetting resin and a filler; and an adhesive layer which is disposed on at least one surface of the resin composition layer, and has arithmetic average surface roughness Ra on the surface not facing the resin composition layer of not larger than 1.5 μm.