LASER PRINTING METHOD FOR NTD SEMICONDUCTOR SUBSTRATE

PROBLEM TO BE SOLVED: To provide a laser printing method for a semiconductor substrate, capable of displaying a character pattern and a discrimination pattern with an uneven shaped printing dot engraving having an excellent depth for visibility even for an NTD silicon wafer by using a YVO4 laser bea...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAKAGUCHI HIROSHI, TAKEDA HISAO, YAO NORIAKI, WARATANI SHUZO, MAIKUMA KEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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